| PART |
Description |
Maker |
| 0546987003 54698-7003 |
0.80mm (.031) Pitch S.O. DIMM Socket, Right Angle, Surface Mount, 5.20mm (.205)Mounted Height, 144 Circuits, 3.3V Power Supply, Hard Tray Packaging, Height11.00mm (.433) Type, Lead-free
|
Molex Electronics Ltd.
|
| 54698-7007 |
0.80mm (.031) Pitch S.O. DIMM Socket, Right Angle, Surface Mount, 5.20mm (.205) Mounted Height, 144 Circuits, 5.0V Power Supply, Hard Tray Packaging, Height9.00mm (.354) Type, Lead-free
|
Molex Electronics Ltd.
|
| 0528304422 52830-4422 |
Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 3-5353652-6 |
HARD TRAY ASSY FH 0.5BTB CONNECTOR PLUG 8H W/G-PLATE ON 2ROW CAP
|
Tyco Electronics
|
| 87891-0204 0878910204 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-1816 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0877580817 87758-0817 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2816 0879142816 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143416 87914-3416 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| PS-55JD1-012M1 PS-55JD1-015M1 PS-55JD1-005M1 PS-55 |
Hi-Rel DC-DC Standard Single Converter in a ATR package; A ATR2812S with Standard Packaging
Hi-Rel RAD-Hard, Dual, 28V Input DC-DC Converter in LS package; Hi-Rel RAD-Hard, Dual, 28V Input DC-DC Converter in LS package
Hi-Rel DC-DC Standard Triple Converter in a ATO package; A ATO2812T with Standard Packaging
Analog IC 模拟IC
|
Electronic Theatre Controls, Inc.
|
| 87957-1005 0879571005 |
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 5 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
